《国家微电子研究战略》.docx

Nationa1.StrategyonMicroe1.ectronicsResearchAReportbytheSUBCOMMITTEEONMICROE1.ECTRONICS1.EADERSHIPCOMMITTEEONHOME1.ANDANDNATIONA1.SECURITYoftheNATIONA1.SCIENCEANDTECHNO1.OGYCOUNCI1.March2024NATIONA1.SCIENCEANDTECHNO1.OGYCOUNCI1.Chair:AratiPrabhakar,AssistanttotheActingExecutiveDirector:KeiKoizumizPresidentforScienceandTechno1.ogy;Principa1.DeputyDirectorforPo1.icy,OfficeDirector,WhiteHouseOfficeofScienceandofScienceandTechno1.ogyPo1.icyTechno1.ogyPo1.icySUBCOMMITTEEONMICROE1.ECTRONICS1.EADERSHIP(SM1.)SM1.Co-Chairs:JasonBoehmzDOC1.isaFriedersdorf,OSTPCar1.McCantsrDODSM1.ExecutiveSecretary:CoreyStambaugh,NISTSUBCOMMITTEEONMICROE1.ECTRONICS1.EADERSHIPPARTICIPANTSOfficeofScienceandTechno1.ogyPo1.icy(OSTP)1.isaFriedersdorfDanaWeinsteinNationa1.EconomicCounci1.(NEC)PeterDevineNationa1.SecurityCounci1.(NSC)Nikita1.a1.waniOfficeofManagementandBudget(OMB)NacKen1.yWi1.1.iamMcNavageOfficeoftheU.S.TradeRepresentative(USTR)RebeccaGudice1.1.oNationa1.CoordinationOfficeforNetworkingandInformationTechno1.ogyR&D(NITRD)CragSch1.enoffNationa1.Nanotechno1.ogyCoordinationOffice(NNCO)BrandenBroughQuinnSpado1.aNationa1.QuantumCoordinationOffice(NQCO)Char1.esTahanDepartmentofCommerce(DOC)Internationa1.TradeAdministration(ITA)Pau1.1.itwin1.ukeMyersNationa1.InstituteofStandardsandTechno1.ogy(NIST)JasonBoehmRichard-DuaneChambersDavidGund1.achJ.A1.exander1.idd1.eEric1.inRobertRudnitskyDepartmentofDefense(DOD)Car1.McCantsA1.isonSmithDevanandShenoyDepartmentofEnergy(DOE)Ha1.Finke1.AndrewSchwartzDepartmentofHea1.thandHumanServices(HHS)Nationa1.InstitutesofHea1.th(NIH)DavidRampu1.1.aDepartmentofHome1.andSecurity(DHS)Ja1.a1.MaparPau1.inePakiDepartmentofState(State)Kako1.iRayMichae1.MasudaE1.izabethMe1.enbrinkScottSe1.1.arsNationa1.ScienceFoundation(NSF)Di1.maDaSi1.vaErwinGianchandaniGermanoIannacchioneBarryJohnsonAnthonyA.MaciejewskiOfficeoftheDirectorofNationa1.Inte1.1.igence(ODNI)JohnBeie1.erEricChengDona1.dParrishTab1.eofContentsAbbreviationsandAcronymsVExecutiveSummaryViIntroduction1TheMicroe1.ectronicsInnovationEcosystem7AWho1.eof-GovernmentApproach10Goa1.1.Enab1.eandAcce1.erateResearchAdvancesforFutureGenerationsofMicroe1.ectronics111.1: Acce1.eratetheresearchanddeve1.opmentofmateria1.sthatprovidenewcapabi1.itiesorfunctiona1.enhancements151.2: Increasethecapabi1.itiesofcircuitdesign,simu1.ation,andemu1.ationtoo1.s161.3: Deve1.opadiversearrayofrobustprocessingarchitecturesandassociatedhardwareneededforfuturesystems161.4: Deve1.opprocessesandmetro1.cyforadvancedpackagingandheterogeneousintegration171.5: Prioritizehardwareintegrityandsecurityasane1.ementinco-designstrategiesacrossthestack181.6: InvestinR&Dformanufacturingtoo1.sandprocessesneededtosupporttransitionofinnovationsintoproduction-worthyfabricationprocesses19Goa1.2.Support,Bui1.drandBridgeMicroe1.ectronicsInfrastructurefromResearchtoManufacturing.212.1: Supportfederatednetworksofdevice-sca1.eR&Dfabricationandcharacterizationuserfaci1.ities222.2: Improveaccessfortheacademicandsma1.1.-businessresearchcommunitytof1.exib1.edesigntoo1.sandwafer-sca1.efabricationresources242.3: Faci1.itateresearchaccesstokeyfunctiona1.materia1.s252.4: ExpandaccesstoadvancedCyberinfrastructurcformode1.ingandsimu1.ation252.5: Supportadvancedresearch,deve1.opment,andprototypingtobridgethe1.abtofabgap262.6: Supportadvancedassemb1.y,packaging,andtesting29Goa1.3.GrowandSustaintheTechnica1.WorkforcefortheMicroe1.ectronicsR&DtoManufacturingEcosystem303.1: Support1.earnersandeducatorsinandacrossscienceandtechno1.ogydiscip1.inesre1.evanttomicroe1.ectronics323.2: Fostermeaningfu1.pub1.icengagementinmicroe1.ectronicsandraiseawarenessofcareeropportunitiesinthesemiconductorindustry343.3: Prepareaninc1.usivecurrentandfuturemicroe1.ectronicsworkforce353.4: Bui1.danddrivemicroe1.ectronicsresearchandinnovationcapacity37Goa1.4,CreateaVibrantMicroe1.ectronicsInnovationEcosystemtoAcce1.eratetheTransitionofR&DtoU.S.Industry394.1: Supportbui1.d,andbridgecenters,pub1.icprivatepartnerships,andconsortiatodeepenco1.1.aborationamongvariousstakeho1.dersinthemicroe1.ectronicsecosystem404.2: Engagewithand1.everagetheCHIPSIndustria1.AdvisoryCommittee444.3: Motivateanda1.ignthemicroe1.ectronicscommunityonkeytechnica1.cha1.1.engeswithR&Droadmapsandgrandcha1.1.enges454.4: Faci1.itateacademic,government,andindustria1.exchangetobroadenunderstandingofneedsandopportunities464.5: Supportentrepreneurship,start-upsrandear1.y-stagebusinessesthroughtargetedprogramsandinvestments46AdvancingResearchandDeve1.opmenttoSupportManufacturingandSupp1.yChainSecurity49Internationa1.Co1.1.aborationandtheRo1.eofTradeandDip1.omacy49FutureDirections51AbbreviationsandACronymS1.MSIminorit-servinginstitution2Dtwo-dimensiona1.3Dthree-dimensiona1.NASANationa1.AeronauticsandSpace3DHI3DheterogeneousintegrationAdministrationADKassemb1.ydesignkitNGMMNext-GenerationMicrosystemsA1.artificia1.inte1.1.igenceManufacturing(DARPprogram)CHIPSCreatingHe1.pfu1.IncentivestoProducenmnanometerSemiconductors(abbreviationforP.1.116-283,Tit1.eXQX,andDivisionAofNNCINationa1.Nanotechno1.ogyCOordinatedInfrastructure(NSFprogram)P.1.117-167NNINationa1.Nanotechno1.ogyInitiativeCMOScomp1.ementarymeta1.oxideSemiconductorNSTCNationa1.SemiconductorTechno1.ogyCenter(a1.so,Nationa1.ScienceandDARPADefenseAdvancedResearchProjectsTechno1.ogyCounci1.)AgencyOECDOrganisationforEconomicCoDTdesign-techno1.ogycooptimizationoperationandQcvc1.opmcntEDAe1.ectronicdesignautomationOSTPOfficeofScienceandTechno1.ogyPo1.icyENIACE1.ectronicNumerica1.IntegratorandPDKprocessdesignkitComputerR11RequestforInformationFFRDCFedera1.1.yFundedResearchandR&Dresearchanddeve1.opmentDeve1.opmentCenterSisi1.iconF1.OPSf1.oating-pointoperationspersecondSTCOsystemtechno1.ogyco-otmatonHBC(三)Historica1.1.yB1.ackCo1.1.egesandUniversitiesSTEMscience,techno1.ogy,engineering,andmathematicsIPinte1.1.ectua1.propertyTCCUTriba1.1.yContro1.1.edCo1.1.egesandKSAsMEMSMGIM1.know1.edge,ski1.1.s,andabi1.itiesmIcroe1.ectromechanica1.systemsMateria1.sGenomeInitiativemachine1.earningUniversitiesSeetheSubcommitteeonMicroe1.ectronecs1.eadershiproster(pp.iii>forspeHingoutofacronymsofparticipatingagencynamesExecutiveSummaryDecadesago,Americaninnovationsparkedtheresearchadvancesthat1.edtothesemiconductorindustryoftoday.Thisindustryisg1.oba1.,underpinseverythingfromhea1.thtocommunications,andisessentia1.fortheeconomyandsecurityoftheUnitedStates.Thesignificantinvestmentsmadepossib1.ebythebipartisanCHIPSActsprovideopportunitiestoreinvigoratedomesticmanufacturinginthiscritica1.sector,andstrengthenthemicroe1.ectronicsresearchanddeve1.opment(R&D)innovationecosystemthatcanadvancetheAmericancompetitivepositionforthefuture.ThisNationa1.StrategyonMicroe1.ectronicsResearchpresentsgoa1.szkeyneedszandactionsrequiredoverthenextfiveyearstorea1.izetheseopportunities.Thisstrategyprovidestheframeworkforfedera1.departmentsandagencies,academia,industry,nonprofits,andinternationa1.a1.1.iesandpartnerstoaddresskeyneedsandbui1.doutthemicroe1.ectronicsresearchanddeve1.opmentinfrastructuretosupportthefutureadvancesthatwi1.1.shapethesemiconductorfie1.d.Ashigh1.ightedthroughoutthisreport,thesignificantCHIPSR&Dinvestmentsunderwaymustbefu1.1.y1.everagedandcoordinatedwiththebroadportfo1.ioofongoingprograms,activities,andresourcesthatcontributetomicroe1.ectronicsresearchanddeve1.opment.Overthenextfiveyears,theWhiteHouseandfedera1.departmentsandagencieswi1.1.worktogethertoadvancefourinterconnectedgoa1.s: Enab1.eandAcce1.erateResearchAdvancesforFutureGenerationsofMicroe1.ectronics Support,Bui1.d,andBridgeMicroe1.ectronicsInfrastructurefromResearchtoManufacturing GrowandSustaintheTechnica1.WorkforcefortheMicroe1.ectronicsResearchandDeve1.opmenttoManufacturingEcosystem CreateaVibrantMicroe1.ectronicsInnovationEcosystemtoAcce1.eratetheTransitionofResearchandDeve1.opmenttoU.S.IndustryThefirstgoa1.focusesonkeyresearchneedsinsevera1.areasthatarerequiredtoacce1.eratetheadvancesrequiredforfuturegenerationsofmicroe1.ectronicsystems.Researchareasinc1.udemateria1.sthatcanprovidenewcapabi1.ities;circuitdesign,simu1.ation,andemu1.ationtoo1.s;newarchitecturesandassociatedhardwaredesigns;processesandmetro1.ogyforadvancedpackagingandheterogeneousintegration;hardwareintegrityandsecurity;andmanufacturingtoo1.sandprocessestoenab1.etransitionofnewinnovationsintoproduction.Theseresearchareasrequireaccesstospecia1.izedtoo1.sandequipment.Thesecondgoa1.isfocusedonsupporting,expanding,andconnectingtheresearchinfrastructurefromsma1.1.-sca1.emateria1.anddevice-1.eve1.fabricationandcharacterizationthroughprototyping,1.arge-sca1.efabrication,andadvancedassemb1.y,packaging,andtesting.Therequiredtoo1.sindudebothsoftware(inc1.udingdesignt1.s)andcommercia1.-sca1.eproductionandmetro1.ogyhardware.Expansionofthedomesticsemiconductorindustryv/i1.1.a1.soexpandopportunitiesforgood-payingjobsacrossthecountry.Goa1.threeidentifieseffortstosupport1.earnersandeducatorsinthedeve1.opmentofthetechnica1.workforcerequiredfromresearchthroughmanufacturing.Fina1.1.y,goa1.fourisfocusedontheentireR&D1.andscapeandpresentsstrategiesandactionstocreateavibrantmicroe1.ectronicsinnovationecosystemtoacce1.eratethetransitionofnewadvancesintocommercia1.app1.ications.Keyeffortsnoton1.ysupportactionsateachstageofthemicroe1.ectronicstechno1.ogydeve1.opmentpathway,buta1.soconnectthevariousnetworksandactivitiestobui1.davirtuouscyc1.eofmicroe1.ectronicsinnovation.Thesefourgoa1.swi1.1.bepursuedinthecontextoftheg1.oba1.natureofthesemiconductorindustry.Asisthecasewiththesemiconductormanufacturingsupp1.ychain,researchfaci1.itiesandta1.entthatsupportthemicroe1.ectronicsinnovationecosystemare1.ocateda1.1.overthewor1.d.Internationa1.co1.1.aboration,trade,anddip1.omacyareimportanttoo1.sto1.everageeffortsandresources,promoteta1.entf1.owandresearchco1.1.aboration,andensuresecuresupp1.ychains.Imp1.ementationofthisstrategywi1.1.resu1.tinavibrantinnovationecosystemthatacce1.eratesnewresearchbreakthroughs,supportsthetransitionoftheseadvancestomanufacturing,andprovidesgood-payingjobstopeop1.ea1.1.acrossAmerica.Afu1.1.ybui1.t-outandwe1.1.-connectedmicroe1.ectronicsresearchinfrastructurewi1.1.providethefoundationforresearcherstoadvancetheirbreakthroughsand1.eadtovirtuousinnovationcyc1.e.Nurturingandsupportingmicroe1.ectronicsinnovationwi1.1.he1.psecurefuture1.eadershipinthesemiconductorindustryforthesecurityandprosperityoftheUnitedStatesanditsa1.1.iesandpartners.IntroductionThemicroe1.ectronics2revo1.utionhastransformedsociety.Near1.ya1.1.aspectsofmodern1.ifearenowdependentonsemiconductortechno1.ogy,inc1.udingcommunications,computing,entertainment,hea1.thcare,energy,andtransportation.Asaresu1.t,microe1.ectronicsareessentia1.totheeconomicandnationa1.securityoftheUnitedStates.Rapidinnovationinthesemiconductorindustryhasbeenfue1.edfordecadesbyresearchanddeve1.opment(R&D)investmentsinhardwareandsoftwarebythefedera1.governmentandtheprivatesector?TheintenseracetoContinua1.1.yincreasetheperformanceandfunctiona1.ityofmicroe1.ectronics,whi1.emaintainingorreducingcostandpowerrequirements,hasdriventhefabricationofeversma1.1.erandmoredense1.yIntegratedmicroe1.ectroniccomponents.Thisminiaturizationhasrequiredcontinuousbreakthroughsinmateria1.s,too1.s,anddesignthathaveenab1.edkeystructureswithinthecomponentstohavedimensionsassma1.1.asafewatomsinsize.Whi1.ereductionsInfeaturesizehave1.edtodramaticincreasesindigita1.informationstorageandprocessingcapacity,therehavea1.sobeenmanysignificantadvancesinana1.ogandnonsi1.icontechno1.ogiesthatarecritica1.forcommunications,power,andsensing.Therequiredadvancesinmanufacturinghavebeenenab1.edbysignificantinvestmentsnoton1.yinR&D,buta1.soindeve1.opingthemanufacturingandmetro1.ogyequipmentandtheassociatedfabrication(,fabs*)andpackagingfaci1.itiesrequiredtomakeadvancedintegratedcircuitsandcomponents.Thecomp1.exityandcostofmanufacturingatthissca1.e-estab1.ishinga1.eadingedge4si1.iconfabcomp1.exnowcoststensofbi1.1.ionsofdo1.1.ars5-hascontributedtosignificantconso1.idationintheindustry.Todayzon1.ythreecorporationsinthewor1.darecompetingtomanufacturethe1.atestgenerationsofadvanced1.ogicdevices.6InJune2021,theWhiteHousere1.easedBui1.dingResi1.ientSupp1.yChains,Revita1.izingAmericanMonufocturing,andFosteringBroad-BosedGrowth,areportoncritica1.supp1.ychains,inc1.udingthesemiconductormanufacturingandadvancedpackagingsupp1.ychain?Thereportnotedthata1.thoughU.S.-headquarteredsemiconductorcompaniesaccountedfornear1.yha1.fofwor1.dwiderevenueztheshareofg1.oba1.semiconductormanufacturingconducteddomestica1.1.yhaddroppedfrom37%in1990to12%zandtheU.S.shareofpackaginghadfa1.1.ento3%,aAsdiscussedinthereport,modernMicroe1.ectronicsinthiscontextreferstointegratede1.ectronicdevicesandsystemsgenera1.1.ymanufacturedu%ingsemiconductor-basedmateria1.sandre1.atedprocessing(i.e.rinasemiconductorfabricationmanufacturingfad1.it.OfSuchdevicesandsystemsinc1.udeana1.oganddigita1.e1.ectronics,powere1.ectronics,opticsandphotoncszandm1.cromechan*csformemory,processing,senngrandcommunicationsapp1.ications.Thesemiconductorindustryreferstothemanufacturingsectorinc1.udingdesignandproductionofproductsconsistingofsemconductor-basede1.ectronicdevicesandintegratedcircuits,a1.ongwithadvancedandpowere1.ectronics.*'1.cadng<*(c*referstothemostminiaturizedor"sca1.ed“putingandmemorytechno1.ogy-current1.ydenotedthe"3nmnode"-WKhnew.sma1.1.ernodesbeingproducedeverytwotothreeyearsForexamp1.e,see,TSMCbokitodobdownonUS.chipfactoriesosta(kiin£uropefa1.ter.httos"wwzk?ba1.b3nkneamnareco11Rdusetsmckx>1.m)ubeownou5YhafaQn2s萤tagnUUrOoe"Her;andInte1.:Upcoming(S.FabW洲BeoSma1.1.Gty,toCost$60to$120Bon.httpsWWWtorrvshardv/are,CanVcewsAngHorDenauo*o12ObJk>nyv11ewusm3nufujr1neubConVeCt7uo1.3ds1heSgrn<or>dVet(XSuDZCh¾r>5Me-8refOdf.BUi付mgR5Wet5ppyOW1.gRevrtodiingAmerkonManufocMing,QodFostertngBroodeosedGrowth.TheWhiteHouse*,2021.htpvwe".whItehQUSQ.oveqcCntontuoid%2021/06/1。OdjV,upph,Uhninrcvowmport.pdf.Note:Tinitia1.report(Wrxxirdepoweretectronicsorotherspecia1.izedSemicOn1.Khasphotovo1.taics(PVs)zw1.chwereAddrctsrdinfo1.1.owonreports:httpq:/WwW.eXrgV.改QrAPQbCWSCUHnjrR11x*rksCgn-cnrrgy>uppvchn.TheU.S.shareofg1.oba1.assemMy,test,andpackagingIsnowestimatedtobeIeSSthan2%:httpyWWWb<s叱CgoVAndmCRhHdp<umrmrchn)k>Rvyv>u>t0<4O2wchQH¾9O4rpprtfi22O231221MS.NAT1.ONA1.STRATEGYONM1.CROE1.EcTRONIcSRESEAReHmicroe1.ectronicsmanufacturingisanincredib1.ycomp1.exandg1.oba1.process,invo1.vinghundredsofstepscomp1.etedoversevera1.months,withmanycomponentsusinginternationa1.expertiseandfaci1.itiesastheytrave